RS 232 Transceiver Module

MORNSUN RS 232 transceiver modules is designed by RS 232 protocol, and it replaces the traditional design by integrating transceiver, isolation chip and high efficient DC/DC isolated power in one module. The modules can be used for inter-communications between devices on the industrial bus, achieving the signal transceiving and power isolation. The targeted market includes automotive industry, rail transportation, smart monitoring, smart meters, etc. We hope those RS 232 transceiver modules are an ideal fit for your application needs.

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  • Product Series

  • Integrated Power

  • No of Channel

  • Transmission Rate(bps)

  • Vin(VDC)

  • Isolation

  • Package

The total RS 232 Transceiver Module : 9. Please check.

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Series Integrated Power No of Channel Transmission Rate(bps) Vin(VDC) Isolation Package Features Footprint & 3D Markings Datasheet Sample Buy
TDx31S232H
1 115.2K 3.3,5 2500VDC SMD High rate
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TD331S232H 1 115.2K 3.3 2500VDC SMD High rate
TD531S232H 1 115.2K 5 2500VDC SMD High rate
TDx01D232H
1 115.2K 3.3,5 2500VDC DIP High rate
-
-
-
-
-
TD301D232H 1 115.2K 3.3 2500VDC DIP High rate
TD501D232H 1 115.2K 5 2500VDC DIP High rate
-
TDx02D232H
2 115.2K 3.3,5 2500VDC DIP High rate
-
-
-
-
-
TD502D232H 2 115.2K 5 2500VDC DIP High rate
-
TD302D232H 2 115.2K 3.3 2500VDC DIP High rate
-
TD(H)541S232H
1 120k 5 5000VDC DFN Ultra-small, ultra-thin, chip-le
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-
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TD541S232H 1 120K 5 3000VDC DFN Ultra-small, ultra-thin, chip-le
-
TD041S232H
- 1 120k 3.3,5 3750VDC DFN Ultra-small, ultra-thin, chip-le
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-
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TD041S232H - 1 120K 3.3,5 3750VDC DFN Ultra-small, ultra-thin, chip-le
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TD341S232H
1 120k 3.3 5000VDC DFN Ultra-small, ultra-thin, chip-le
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-
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TD341S232H 1 120k 3.3 5000VDC DFN Ultra-small, ultra-thin, chip-le
-

* For reference only. The detailed info please refer to the datasheet.

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