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Ultra-thin DFN package Isolated CAN/RS485 Transceiver - TD541S485H-S, TD5(0)41SCANH-S Series

Ultra-thin DFN package Isolated CAN/RS485 Transceiver - TD541S485H-S, TD5(0)41SCANH-S Series.jpg

Introduction

To meet the diverse design needs of customers, MORNSUN is continuously upgrading its solutions through technological innovation and platform upgrades. MORNSUN recently completed the upgrade of the CAN/RS485 bus isolation transceiver module R4 series and launched the R4S series CAN/RS485 bus isolation transceiver module with a more cost-effective and smaller size.  The R4S series comes with a thinner sidewall-copper package, making it an ideal option for those seeking a thinner solution.


Advantages

1. Ultra-small, ultra-thin, chip scale DFN package

The R4S thickness is reduced by 0.4mm than the R4 series and can be pin-to-pin compatible with the R4 series products.


2. High reliability with comprehensive protections

The R4S series provides integrated ESD, surge, pulse group, and bus failure protections. It meets AEC-Q100 requirements and passes a series of reliability tests, including the impact test, high temperature and high humidity, and moisture-sensitive MSL3 test.


3. Excellent EMI immunity, compliant with EMI Class B standards

Test Data of CE.jpg

Test Data of CE

Test Data of RE.jpg

Test Data of RE


Applications

R4S series meets a variety of bus communication applications, covering industrial control, nuclear power chemical industry, building automation, medical equipment, machinery automation, and other occasions.

R4S series' typical application is Industrial control and Medical.jpg


Features

  • Ultra-small, ultra-thin, chip-scale DFN package

  • Wide input voltage range: 4.5-5.5V

  • High isolation voltage up to 5000VDC

  • Baud rate up to 10Mbps

  • Operating temperature range: -40℃ to +105℃

  • CMTI>25kV/us

  • Bus failure protection, Bus driver short circuit protection

  • Excellent EMI immunity, compliant with EMI Class B standard with peripheral circuit


* For detailed information please refer to the related datasheet, product news is for reference only.
Please refer to the technical manual for specific product parameters:

Series Integrated Power No of Channel Transmission Rate(bps) Vin(VDC) Nodes Number Isolation Package Features Footprint & 3D Markings Datasheet Sample Buy
TD041SCANH-S - 1 1M 3.3,5 110 3750Vrms DFN Ultra-small, ultra-thin, chip-le
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TD541S485H-S - 10M 5 256 5000VDC DFN Ultra-small, ultra-thin, chip sc
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TD541SCANH-S 1 1M 3.3,5 110 5000VDC DFN Ultra-small, ultra-thin, chip-le
-

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