Ultra-thin DFN package Isolated CAN/RS485 Transceiver - TD541S485H-S, TD5(0)41SCANH-S Series

Ultra-thin DFN package Isolated CAN/RS485 Transceiver - TD541S485H-S, TD5(0)41SCANH-S Series.jpg


To meet the diverse design needs of customers, MORNSUN is continuously upgrading its solutions through technological innovation and platform upgrades. MORNSUN recently completed the upgrade of the CAN/RS485 bus isolation transceiver module R4 series and launched the R4S series CAN/RS485 bus isolation transceiver module with a more cost-effective and smaller size.  The R4S series comes with a thinner sidewall-copper package, making it an ideal option for those seeking a thinner solution.


1. Ultra-small, ultra-thin, chip scale DFN package

The R4S thickness is reduced by 0.4mm than the R4 series and can be pin-to-pin compatible with the R4 series products.

2. High reliability with comprehensive protections

The R4S series provides integrated ESD, surge, pulse group, and bus failure protections. It meets AEC-Q100 requirements and passes a series of reliability tests, including the impact test, high temperature and high humidity, and moisture-sensitive MSL3 test.

3. Excellent EMI immunity, compliant with EMI Class B standards

Test Data of CE.jpg

Test Data of CE

Test Data of RE.jpg

Test Data of RE


R4S series meets a variety of bus communication applications, covering industrial control, nuclear power chemical industry, building automation, medical equipment, machinery automation, and other occasions.

R4S series' typical application is Industrial control and Medical.jpg


  • Ultra-small, ultra-thin, chip-scale DFN package

  • Wide input voltage range: 4.5-5.5V

  • High isolation voltage up to 5000VDC

  • Baud rate up to 10Mbps

  • Operating temperature range: -40℃ to +105℃

  • CMTI>25kV/us

  • Bus failure protection, Bus driver short circuit protection

  • Excellent EMI immunity, compliant with EMI Class B standard with peripheral circuit

* For detailed information please refer to the related datasheet, product news is for reference only.
Please refer to the technical manual for specific product parameters:

Series Integrated Power No of Channel Transmission Rate(bps) Vin(VDC) Nodes Number Isolation Package Features Footprint & 3D Markings Datasheet Sample Buy
TD041SCANH-S - - 1M 3.3,5 110 3750Vrms DFN Ultra-small, ultra-thin, chip-le
TD541S485H-S - 10M 3.3,5 256 5000VDC DFN Ultra-small, ultra-thin, chip sc
TD541SCANH-S - 1M 3.3,5 110 5000VDC DFN Ultra-small, ultra-thin, chip-le

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